FIB-SEM tomography is performed using automated Auto Slice and View ^TM software on Thermo Fisher Scientific DualBeam microscopes. This software facilitates serial ion-beam milling of thin layers from a cross-sectional face of a sample, capturing electron micrographs between each cut into the face*. Once the desired region of the sample has been milled and imaged, the software reconstructs a 3D model by stitching the collected 2-dimensional cross-sections into a composite volume. Once the 3D reconstruction is produced, it can be manipulated and analyzed to make dimensional measurements of internal structures and features of interest.

By combining FIB-SEM tomography with EDS or EBSD, analysts can investigate elemental distributions and crystallinity throughout a 3D reconstructed volume. This can be particularly useful in the analysis of alloys, porous materials, or integrated circuits and microprocessors.

* FIB-SEM tomography can cause higher-than-normal charge buildup in certain nonconductive samples. To mitigate this, it may be necessary to sputter coat the sample with a conductive metallic layer. Furthermore, depending on the shape and material of the sample, embedding the sample in resin may improve imaging resolution by fixing its position in a rigid mount.